Join Baya Systems at The Future of Chiplets 2025 – A Virtual EE Times Event
July 30–31, 2025 | Online, Global Access
Joint solution reduces risk and accelerates time-to-silicon for advanced semiconductor platforms
The chiplet era is here, and it’s redefining what’s possible in semiconductor design. At The Future of Chiplets 2025, Baya Systems joins industry leaders to explore how modular architectures, high-performance fabrics, and system-level innovation are transforming everything from AI infrastructure to edge devices.
Don’t Miss Our Executive Sessions
Couldn’t attend DAC? Now’s your chance to hear from Baya’s leadership, wherever you are in the world.
Baya’s CEO and CCO will present two cornerstone sessions during this event:
- Developing the Chiplet Economy – Nandan Nayampally, CCO, Baya Systems
A panel discussion exploring how ecosystem collaboration, scalable IP, and open standards are driving the chiplet revolution. - Unleashing Scale Through Chiplets – From Concept to Deployment – Dr. Sailesh Kumar, CEO, Baya Systems
A deep dive into how Baya’s software-driven fabric IP and intelligent tile partitioning enable scalable AI systems, from edge to cloud.
Why This Matters
As complexity rises and monolithic scaling reaches its limits, chiplets offer a path forward. But achieving performance, efficiency, and flexibility at scale requires more than silicon, it demands smart fabrics, efficient data movement, and a modular design mindset. That’s where Baya comes in.
Be Part of the Conversation
Whether you’re architecting next-gen AI systems or rethinking your packaging strategy, this event will deliver key insights into:
- High-bandwidth, low-latency interconnects for chiplets
- Combining modular integration with tile-based partitioning to enable scalable, heterogeneous systems
- Standards, simulation, and design frameworks accelerating adoption
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