Markets
Data Center Market
The rapid growth of AI, cloud computing, and large-scale distributed systems is driving unprecedented demand for data center performance and efficiency. As compute, memory, networking, and accelerator resources scale across increasingly complex architectures, moving data efficiently has become one of the industry's most critical challenges.
Modern data centers depend on seamless communication between CPUs, GPUs, AI accelerators, memory, storage, and networking infrastructure. Bottlenecks in connectivity can limit system performance, increase power consumption, and reduce overall resource utilization, ultimately constraining the value of expensive compute investments.
Baya helps architects overcome these challenges with scalable fabric architectures and software-driven design tools that optimize data movement across the system. From architecture exploration through deployment, Baya enables high-bandwidth, low-latency connectivity that helps maximize performance, efficiency, and scalability for next-generation data center infrastructure.
Support communication across increasingly complex SoCs, chiplets, accelerators, memory, and I/O subsystems without sacrificing performance.
Deliver efficient movement of data between compute and memory resources to maximize utilization and throughput.
Enable scalable multi-die and heterogeneous chiplet designs with optimized die-to-die communication.
Advanced QoS, congestion management, and workload-driven optimization help ensure consistent system behavior under demanding workloads.
Analyze, optimize, and validate system architectures before implementation using workload-driven simulation and design automation.
WeaveIP delivers built-in reliability, availability, and serviceability, with fine-grained ECC, fault containment, and cross-die telemetry to detect failures early and keep AI and HPC systems running.
Built-in QoS, congestion isolation, and physically-aware tiling deliver predictable tail latency — even under mixed workload pressure.
Built-in QoS, congestion isolation, and physically-aware tiling deliver predictable tail latency — even under mixed workload pressure.
Built-in QoS, congestion isolation, and physically-aware tiling deliver predictable tail latency — even under mixed workload pressure.
Enable efficient communication between GPUs, AI accelerators, and memory within a server or rack-scale system. High-bandwidth, low-latency connectivity is critical for maximizing accelerator utilization and training performance.
Support communication across distributed AI clusters, enabling scalable architectures that efficiently move data between compute resources while minimizing congestion and bottlenecks.
Power next-generation AI and data center networks with scalable, non-blocking switch fabrics designed for extreme port density, low latency, and predictable performance at scale.
Connect diverse compute, memory, storage, and networking resources across increasingly complex cloud infrastructure while maintaining performance and efficiency.
Product Spotlight
As AI infrastructure scales, efficient communication becomes just as important as compute performance. NeuraScale is a scalable, non-blocking switch fabric designed for AI scale-up and scale-out architectures, delivering high-bandwidth, low-latency connectivity across accelerators, memory, and networking resources. With extreme port density and predictable performance under demanding workloads, NeuraScale helps architects build the next generation of AI and data center infrastructure.
The IoT market is scaling toward 30 billion connected devices, and AI inference is rapidly shifting from the cloud to the edge.
Modern infrastructure systems require flexible, reliable connectivity across diverse processing elements, memory, and I/O subsystems. Baya’s configurable fabrics provide the scalability, performance, and reliability needed for networking, communications, and high-performance infrastructure applications.
As AI models grow in size and complexity, efficient data movement becomes as critical as compute performance. Baya enables scalable AI accelerator architectures with optimized connectivity, chiplet-aware fabrics, and high-performance interconnect solutions designed for training and inference workloads.
The shift toward software-defined vehicles and centralized compute architectures demands faster, more reliable communication between processors, sensors, memory, and accelerators. Baya provides scalable, efficient fabrics that enable high-performance automotive systems with the reliability and flexibility required for next-generation vehicles.
Intelligent IoT devices require efficient connectivity within increasingly complex systems while balancing performance, power, and cost. Baya enables optimized data movement for scalable IoT architectures, from advanced edge devices to connected intelligent systems.
