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From AI infrastructure to intelligent edge systems, Baya helps chip designers solve the data movement challenges behind today’s most advanced silicon.
As SoCs and chiplet-based architectures scale, moving data efficiently across compute, memory, accelerators, and I/O becomes critical to system performance.
Baya combines scalable fabric IP with software-driven design tools to help customers architect, optimize, and deploy high-performance silicon for data centers, infrastructure, AI acceleration, automotive, and IoT.
AI-driven data centers are scaling at an unprecedented pace, demanding efficient communication between processors, accelerators, memory, and networking components. Baya delivers scalable, high-bandwidth fabrics that eliminate data movement bottlenecks and enable the next generation of AI and cloud infrastructure.
Modern infrastructure systems require flexible, reliable connectivity across diverse processing elements, memory, and I/O subsystems. Baya’s configurable fabrics provide the scalability, performance, and reliability needed for networking, communications, and high-performance infrastructure applications.
As AI models grow in size and complexity, efficient data movement becomes as critical as compute performance. Baya enables scalable AI accelerator architectures with optimized connectivity, chiplet-aware fabrics, and high-performance interconnect solutions designed for training and inference workloads.
The shift toward software-defined vehicles and centralized compute architectures demands faster, more reliable communication between processors, sensors, memory, and accelerators. Baya provides scalable, efficient fabrics that enable high-performance automotive systems with the reliability and flexibility required for next-generation vehicles.
Intelligent IoT devices require efficient connectivity within increasingly complex systems while balancing performance, power, and cost. Baya enables optimized data movement for scalable IoT architectures, from advanced edge devices to connected intelligent systems.
High-bandwidth, low-latency fabrics designed to scale from individual SoCs to large multi-chiplet and AI systems.
Optimize communication across compute, memory, accelerators, and I/O to eliminate system bottlenecks.
Support diverse protocols, topologies, and system requirements with configurable fabric solutions.
Enable heterogeneous multi-chiplet architectures with scalable die-to-die connectivity and optimized communication.
Ensure predictable system behavior with deadlock-free operation, advanced QoS, RAS, and comprehensive monitoring.
Built by industry pioneers with decades of experience designing scalable interconnect architectures for the world’s most advanced silicon systems.
Product Spotlight
Baya collaborates with the companies shaping the future of intelligent compute, from CPU and accelerator providers to EDA leaders, silicon partners, and industry standards organizations.
An expanding ecosystem of technology leaders, including Arm, Synopsys, Intel Capital, Tenstorrent, Semidynamics, Andes, Aion Silicon, and industry initiatives such as UCIe and Ultra Accelerator Link.
Built on open standards and broad ecosystem collaboration, Baya enables customers to develop scalable architectures that integrate seamlessly with today’s and tomorrow’s silicon platforms.
Industry Ecosystem
Baya collaborates with the companies shaping the future of intelligent compute, from CPU and accelerator providers to EDA leaders, silicon partners, and industry standards organizations.
An expanding ecosystem of technology leaders, including Arm, Synopsys, Intel Capital, Tenstorrent, Semidynamics, Andes, Aion Silicon, and industry initiatives such as UCIe and Ultra Accelerator Link.
Built on open standards and broad ecosystem collaboration, Baya enables customers to develop scalable architectures that integrate seamlessly with today’s and tomorrow’s silicon platforms.
Partner Ecosystem
Scalable fabric IP supporting coherent, non-coherent, and custom protocols with a common transport architecture optimized for performance, flexibility, and scale.
Accelerate architecture exploration with workload-driven analysis, correct-by-construction design, and automated generation of deployment-ready fabric implementations.
Move confidently from architecture to implementation with scalable fabric IP optimized for physical design, performance, power, and area.