Joint solution reduces risk and accelerates time-to-silicon for advanced semiconductor platforms
Don’t miss our upcoming webinar with Tenstorrent, where we’ll explore how software-driven fabrics and chiplet-ready interconnects are redefining AI subsystem design. Learn how combining Baya’s WeaveIP™ with Tenstorrent’s Ascalon™ processors enables higher throughput, lower latency, and faster time-to-market for next-gen AI architectures.
Date & Location
When: Nov 13, 2025
Where: Virtual – Live
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