Join Us at Embedded World 2026

Join Us at Embedded World 2026: Hall 5, Stand 238

Joint solution reduces risk and accelerates time-to-silicon for advanced semiconductor platforms

Meet Baya Systems at Embedded World 2026 in Nuremberg and discover how software-driven, chiplet-ready system architectures are transforming the way intelligent systems scale. Visit us at Booth #238, Hall 5, and join our technical session to explore the future of data movement, modular design, and system-level optimization.

About the Event

Embedded World is one of the world’s leading gatherings for the embedded systems community, bringing together innovators across industrial, automotive, IoT, AI, and infrastructure markets. The event highlights the technologies, architectures, and design methodologies shaping the next generation of intelligent, connected systems.

Baya’s Presence

Booth: #238, Hall 5

Visit the Baya Systems team to learn how architecture-first, software-driven design approaches enable scalable, chiplet-ready system development and faster time-to-market for complex intelligent platforms.

Technical Session

Title: Scaling Intelligent Systems: Data Movement, Chiplets, and Software-Driven Architecture
Speaker: Nandan Nayampally, Chief Commercial Officer, Baya Systems
Date & Time: Tuesday, March 10, 11:30 AM
Location: Hall 5 Stage

This session explores the rapid growth of intelligent processing workloads and the system-level challenges they introduce, including increasing heterogeneity, performance scaling limits, and development complexity. Attendees will learn how modular, chiplet-based architectures and topology-agnostic, software-driven fabrics enable efficient data movement, global system optimization, and accelerated development cycles for next-generation intelligent systems.