Joint solution reduces risk and accelerates time-to-silicon for advanced semiconductor platforms
Baya is on the move. From a major new collaboration with Kandou AI to our expansion into Japan, we’re continuing to grow our global footprint and strengthen our role in the future of AI infrastructure. Catch up on the latest company news, hear fresh perspectives from Tech Threads, see where Baya is making headlines, and find out where to meet us next.
Kandou AI Selects Baya Systems to Power Its Attack on the AI Memory Wall
Following our Openchip news, we're equally excited to share our second major licensing announcement of the summer: Kandou AI, leading Lausanne-based pioneer of Copper MIMO (Chord Signaling) interconnect technology, has selected Baya Systems' WeaveIP™ software-defined fabric and WeaverPro™ platform to power its next-generation 448 Gbps AI connectivity products.
This is further validation of Baya's role as the architectural backbone for AI infrastructure. Kandou AI's Chord signaling technology tackles the physical layer of AI interconnect, but as both companies point out, breakthrough signaling alone doesn't solve the memory wall. That's a system-level challenge, and is where Baya's fabric comes in: managing data movement between heterogeneous compute engines, memory, I/O, and chiplets so that Kandou's physical-layer gains actually translate into system-level performance.
Kandou AI is using WeaverPro to explore and validate on-chip interconnect configurations, including traffic-class partitioning, QoS policy, and protocol adaptation, before committing to RTL, and the companies say the tiled, pre-verified nature of Baya's fabric primitives is expected to meaningfully accelerate Kandou's development cycles.
Baya Systems Expands to Japan
Baya Systems is expanding into Japan, one of the world's fastest-growing semiconductor markets, deepening engagement with the foundries and technology leaders building AI, HPC, automotive, and chiplet-based systems there. As part of the expansion, Baya is collaborating with Tenstorrent on a test chip incorporating our WeaveIP™ fabric IP, building on Tenstorrent's adoption of WeaveIP™ across its TT-Ascalon™ and Tensix Neo™ platforms.
This expansion builds on Baya’s already sizable presence in North America, Europe, and South Asia, underlining Baya’s global momentum. As Japan’s semiconductor ecosystem continues to grow, intelligent design and data movement will become ever more important.
"Japan is emerging as one of the most important centers for AI silicon innovation," said Nandan Nayampally, Chief Commercial Officer at Baya Systems. "As companies adopt chiplet architectures and AI-specific silicon, they need system IP that lets them scale without adding design complexity."
Upcoming Events
Come Meet Baya at the AI infra Summit
AI Infra Summit 2026 Mark your calendars for September 15–17, 2026, when we'll be back at the Santa Clara Convention Center for AI Infra Summit. Come find us to talk through the infrastructure challenges, from data centers to data movement, shaping the next generation of AI systems.
Latest Tech Threads Podcast Episodes
Episode 13: The Memory Maze: Copper, Optics, and the Future of AI Data Movement
Our most recent episode focuses on copper: the incumbent material for data movement, which Kandou AI is betting still has a significant future ahead of it. Nandan is joined by Srujan Linga, CEO of Kandou AI, to explore the relative strengths of optical and copper connections, Kandou's unique application of information theory to communications, and how the memory wall is becoming the critical bottleneck in AI workloads. Timed to our Kandou partnership, the conversation digs into what networking technologies we'll need for AI's next step forward as we drive toward artificial general intelligence.
Episode 12: Chiplets, RISC-V, and Europe’s Silicon Ambition
Episode 12 turns the lens on Europe, as Nandan and Cesc Guim, CEO of OpenChip, explore how open, RISC-V-based architectures and chiplet strategies are shaping the continent's push for sovereign AI and HPC silicon. Timed to our expanding European footprint and the Openchip partnership, the conversation digs into what it will take for European chipmakers to compete on the global AI infrastructure stage, and why interconnect and system-level architecture are as central to that ambition as the processors themselves.
You can tune in to Baya’s podcasts on a variety of platforms, so you can listen wherever, whenever works best for you! Don't miss out on the latest insights and conversations from the world of innovation.
Baya Systems in the News
Nandan and other members of our team share insights from Baya. Read on:
Untangling Chip Traffic Jams
Designing Electro-Optical Chips
AI Is Rewriting the IP Playbook
Blog Review: July 29
Check out the below to see where else we’ve been in the news!
Evertiq – Baya Systems Partners with Openchip on Next-Gen Intelligent Compute
IndexBox – Navigating the Complex World of Semiconductor Interconnects in 2026
Tech Trailblazers – Seven Tech Trailblazers Alumni Making News Across Fintech, Chiplets, Quantum Security, AI Infrastructure, and Cyber Resilience
HPCwire – Baya Systems and Kandou AI Partner to Tackle AI Memory Wall
Converge Digest – Kandou AI Selects Baya Systems Fabric IP for 448G Connectivity Platform
StorageNewsletter – Kandou AI Selects Baya Systems to Power Its Attack on the AI Memory Wall
Yahoo Finance – Kandou AI Selects Baya Systems
Semiconductor Engineering - Chip Industry Week in Review
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