Visit Baya at AI Infra Summit, September 15–17, 2026
Joint solution reduces risk and accelerates time-to-silicon for advanced semiconductor platforms
Join the Baya Systems team at Booth #717-719 in Santa Clara, CA, from September 15–17 for live demos and a deep dive into scalable fabric IP for AI clusters and chiplet-based designs.
About the Event
The AI Infra Summit is the world’s largest and most established conference focused on the full-stack infrastructure layer of AI and Machine Learning. Returning to the Santa Clara Convention Center, the 2026 summit brings together over 3,500 industry leaders to explore hardware systems, edge AI, and the evolving AI data center.
Scale-Up: High-Performance Networking Architectures for AI Training and Inference
- 15 Sep 2026
- 11:20 AM - 12:00 PM (Your local time: 14:20 - 15:00)
- Data Movement
Speakers
Nandan Nayampally
CCO, Baya Systems
Deepti Chandra
VP, Product & Marketing ,
Upscale AI
Vivek Sarathy
VP, Product , iPronics
Breaking the AI Bottleneck at AI Infra Summit 2026
Visit Our Booth
Location: Booth #717-719, Exhibition Hall
- Experience the future of data movement with live demonstrations of WeaveIP™ and WeaverPro™. See firsthand how our “correct-by-construction” design platform and multi-level coherent fabric IP break the AI bottleneck—optimizing PPA and accelerating the deployment of complex SoC and chiplet architectures for next-gen scale-out systems.
Technical Session
Title: From Bottleneck to Breakthrough: Data Movement for AI at Scale
Speaker: Nandan Nayampally, CCO at Baya Systems
Schedule: 16 Sep 2026, 2:00 PM – 2:20 PM PT
Location: Data Movement Track
Abstract: The AI performance barrier has shifted from compute power to data movement. With a 100x surge in token processing expected by 2030 and only a 2x power budget, efficiency is the new “tokenomics.” This session explores how to solve bottlenecks across every layer, from nanometer-scale silicon to meter-scale racks. Learn how to transform data orchestration into a competitive advantage and unlock the next wave of AI performance through software-defined fabric.
Connect & Consult
We invite you to sit down with our technical leadership to discuss your specific challenges in Chiplets, Interconnect IP, and AI Scaling.
Meet the Baya Team Onsite:
Nandan Nayampally
Chief Commercial Officer
Saurabh Gayen
Chief Solutions Architect
Kent Orthner
Principal Solutions Architect
Casey Axe
Vice President of Business Development
Book a meeting with our team here
To schedule a private 1-on-1 meeting, please reach out to contact@bayasystems.com.
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