Joint solution reduces risk and accelerates time-to-silicon for advanced semiconductor platforms
A landmark period of Baya’s growth last year created a launchpad. This edition highlights how our recent milestones, such as our global expansion into the U.K. and our deepening ecosystem partnerships, are accelerating our momentum as we build the next generation of technology. As we advance through 2026, our software-driven and chiplet-ready system design platform is solving even tougher scaling challenges. We invite you to explore our latest technical insights, catch up on our recent industry recognition, and see how we are shaping the next era of AI infrastructure.
Ecosystem Synergy: From Architecture to Implementation
Baya Systems and Aion Silicon Partner to Accelerate Next-Generation SoC and Chiplet Designs
We are excited to announce our strategic partnership with Aion Silicon to streamline the development of advanced SoC and multi-die chiplet designs for the AI, HPC, and automotive markets. By pairing our WeaverPro architecture exploration tools and WeaveIP™ fabric technology with Aion Silicon’s end-to-end ASIC design services, the customer gets a "correct-by-construction" workflow that significantly reduces integration risks.
This provides developers with a scalable, high-performance data-movement backbone and a predictable path from initial architectural concept to high-volume silicon production. This substantially derisks system deployment and shortens the time-to-market for complex, heterogeneous systems.
Blog: Accelerating System Architecture and Implementation
Toward the integration of Baya FabricStudio™ with Synopsys Platform Architect™
We have partnered with Synopsys to streamline the design of complex AI and multi-die systems by integrating our FabricStudio with Synopsys Platform Architect. This collaboration aims to bridge the gap between early-stage architecture exploration and physical implementation, allowing us to help designers automatically generate cycle-accurate SystemC models of on-chip fabrics. The built-in high-performance, accurate simulation of complex Network on Chips integrated into Platform Architect enables architects to identify data movement bottlenecks and performance issues much earlier in the design cycle. This integrated approach significantly reduces the risk of costly late-stage redesigns, ensuring that our customers' next-generation chiplets and SoCs meet their performance targets while accelerating overall time-to-market.
Blog: From Standards to Systems: Navigating the Chiplet Era on Arm
How Baya Ignites Scalable AMBA-compliant System Connectivity
The semiconductor industry is entering a new era of modular design, and we are at the center of this shift by providing the "nervous system" for next-generation chiplet architectures. In a strategic partnership with Arm as members of the ASPA (AMBA Specification Partnership Agreement) to contribute to Arm’s open AMBA standards, we are also working closely with Arm’s Chiplet Specification Architecture (ACSA) and leveraging AMBA CHI C2C to move beyond simple die-to-die connectivity toward intelligent, system-level orchestration. Our unified, software-driven fabric allows heterogeneous components like CPUs, GPUs, and NPUs to operate as a singular, coherent system, addressing the critical data-movement bottlenecks inherent in large-scale AI workloads. The multi-level coherency of Baya products combined with chiplet-ready analysis through WeaverPro software enables developers to build scalable and efficient chiplet-based platforms that are "correct by construction," significantly reducing the cost and complexity of modern silicon design.
Baya Systems Expands Bengaluru Engineering Hub to Scale AI, Automotive and HPC Innovation
Our mission to redefine system fabric design is going global. We are expanding our engineering hub in Bengaluru, a move that significantly boosts our capacity to innovate for the AI, automotive, and HPC markets.
This growth taps into incredible local talent and accelerates the development of our Weaver platform. By strengthening our presence in one of the world's premier technology centers, we occupy a prime position to help our customers solve their most complex data movement challenges.
Upcoming Events
Heading to RISC-V Summit Europe this June?
Visit us at| Bologna Congress Center
June 8–12, 2026
As RISC-V matures into a foundational architecture for European technological sovereignty, the challenge shifts from core design to system-level integration. We will be on-site to demonstrate how our architecture-first, software-driven approach breaks the data movement bottleneck for the next generation of RISC-V SoCs and chiplets.
Stop by for live demonstrations of:
WeaverPro™ Software: Watch how our system architecture exploration platform provides data-driven analysis and algorithmic optimization to de-risk complex designs.
WeaveIP™ Fabric technology: See our unified, chiplet-ready fabric in action, supporting seamless coherent (CHI) and non-coherent (AXI/ACE) transport with multi-petabyte/s scalability.
Whether you are scaling AI infrastructure, automotive platforms, or high-performance computing, our team shows you how we turn fragmented components into a unified, high-performance system.
Watch & Learn
Now On-Demand: Scaling Coherency in the Chiplet Era
During the Chiplet Summit last month Kent Orthner dove into how a software-defined unified fabric enables the seamless transport of coherent (CHI), and custom protocols across die boundaries. In this session, he explored how we make your multi-chiplet system behave like a single piece of silicon while achieving:
Provable deadlock freedom and improved power/area efficiency.
Throughput scaling for multi-petabyte/s systems.
Data-driven optimization from specification to post-silicon.
If you are building the next generation of AI, automotive, or data-center platforms, you can now catch our full recording below!
Watch & Learn
Episode 8: From Arduino to AI Infrastructure
In this episode of our podcast, we trace the journey of how simple hardware experimentation evolves into the complex infrastructure powering today’s AI. Our guest, Sander Arts, Fractional CMO and growth advisor at Oranges Tulip Consulting, shares insights shares insights on the foundational shifts in the industry, moving from basic microcontroller projects to the sophisticated, high-performance fabrics required for modern data centers.
Whether you are a hardware enthusiast or a system architect, this conversation provides a unique perspective on how the principles of design remain constant even as the scale and complexity of our silicon reach new heights.
Episode 9: Inside the AI Bottleneck
AI’s growth has long been driven by more compute, but as Jensen Huang recently pointed out, the industry is hitting a new wall: data movement. As AI systems scale, performance is no longer just about processing power, but about efficiently moving and managing data across complex, distributed architectures. In this Tech Threads episode, experts from Intel, Arm, and Texas Instruments explore what this shift means for the future of AI system design.
You can now tune in to Baya’s podcasts on a variety of platforms, so you can listen wherever, whenever works best for you! Don't miss out on the latest insights and conversations from the world of innovation.
Watch & Learn
AI’s growth has long been driven by more compute, but as Jensen Huang recently pointed out, the industry is hitting a new wall: data movement. As AI systems scale, performance is no longer just about processing power, but about efficiently moving and managing data across complex, distributed architectures. In this Tech Threads episode, experts from Intel, Arm, and Texas Instruments explore what this shift means for the future of AI system design.
Join our Team
We are hiring! With rapid growth, we’re expanding our engineering (software and hardware) and commercial teams. We encourage you to explore opportunities and join the team.
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