DAC 2025 June 23 – 25

Baya Systems at DAC 2025

Inside DAC 2025

Joint solution reduces risk and accelerates time-to-silicon for advanced semiconductor platforms

DAC 2025 brought together innovators from across the semiconductor landscape to discuss the next wave of breakthroughs in AI-driven design, chiplet integration, and sustainable system architectures. Held at the Moscone Center, the event was a convergence of engineering minds exploring how to scale innovation efficiently and intelligently.

Our Presence, Our Voice

At Booth 2430, Baya engaged directly with system architects and chip designers to showcase how our software-driven fabric IP delivers modularity, efficiency, and scale for AI, HPC, and automotive applications. Our story resonated with those seeking pragmatic, forward-looking chiplet solutions. Coming off a year of rapid growth and ecosystem traction, our presence at DAC underscored the momentum behind our platform, and the market’s readiness for chiplet-ready innovation.

Baya’s Momentum Is Building

As industry demand for scalable, chiplet-based solutions grows, Baya continues to accelerate. In just over a year out of stealth, our IP is already in development with top-tier AI system providers and gaining recognition across the ecosystem, from partnerships to analyst interest and media coverage. Our solutions tackle the growing challenge of efficient data movement across dies and domains, enabling performance at scale without sacrificing power or latency. DAC 2025 was a powerful validation point: our solutions are timely, our vision is resonating, and our momentum is unmistakable.

Want to learn more about our journey since emerging from stealth? Read our Momentum press release to see highlights from our first year of hypergrowth.

Advancing the Chiplet Ecosystem

Panel: Developing the Chiplet Economy With participation from Baya’s CCO, Nandan Nayampally, this panel explored the essential ingredients for a thriving chiplet marketplace, from open standards and interface protocols to verification tools and vendor collaboration. Talk: Unleashing Scale Through Chiplets CEO Dr. Sailesh Kumar highlighted how Baya’s IP and system-level design approach support chiplet deployment in real-world AI and data-intensive environments.

Want to dive deeper into these topics? Join our executives at the upcoming EE Times Future of Chiplets virtual event on July 30–31 as they discuss the next phase of chiplet innovation. Register now to reserve your spot.

Industry Buzz Around Baya

Coverage from media spotlighted Baya’s leadership in chiplet IP and system design. DAC attendees praised our modular, deployment-ready approach to interconnect challenges.