Embedded.com: Baya Systems Raises $36M to Accelerate Intelligent Compute with Chiplet Technology  Embedded.com: A recent interview with Nandan Nayampally, Baya Systems […]
VentureBeat: Baya Systems raises $36M for AI and Chiplet Innovation  VentureBeat: In this newly published article, VentureBeat Lead Writer, Dean Takahashi,
Barriers To Chiplet Sockets (Part 3)  Semiconductor Engineering  In Part Three of Semiconductor Engineering’s Experts at the Table series, industry leaders dive into
What Comes After HBM For Chiplets (Part 2)  Semiconductor Engineering  In Part Two of the Experts at the Table series, leaders from Baya
Defining The Chiplet Socket (Part 1)  Semiconductor Engineering  “Experts At The Table: The semiconductor industry has been buzzing with the possibilities
Weaving State-of-the-Art Chiplet and SoC Fabrics  Electronics Engineering Journal  “To address the needs of artificial intelligence and data center type
Transformer-specialized ASIC; new NoC IP solutions; formal verification for C++ designs  EDA Cafe “Baya’s NoC IP – Startup Baya Systems has emerged
Baya Systems looks to transform SoCs and Chiplets for emerging Applications via NewElectronics Baya Systems has emerged from stealth mode and has
Tenstorrent licenses Baya’s WeaveIP via ElectronicsWeekly.com  “Baya Systems provides single-die or multi-die, chiplet-ready systems for Intelligent Compute. Its WeaverPro software and Weave
Software/IP Aids Sophisticated SoC Development via Electronic Product Design and Test (EPDT)  Californian start-up Baya Systems has just announced the 1st offerings
