Semiconductor Engineering: What Comes After HBM For Chiplets (Part 2)
What Comes After HBM For Chiplets (Part 2) Semiconductor Engineering In Part Two of the Experts at the Table series, leaders from […]
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Semiconductor Engineering: Defining The Chiplet Socket (Part 1)
Defining The Chiplet Socket (Part 1) Semiconductor Engineering “Experts At The Table: The semiconductor industry has been buzzing with the
Electronics Engineering Journal: Weaving State-of-the-Art Chiplet and SoC Fabrics
Weaving State-of-the-Art Chiplet and SoC Fabrics Electronics Engineering Journal “To address the needs of artificial intelligence and data center type
EDA Cafe: Transformer-specialized ASIC; new NoC IP solutions; more
Transformer-specialized ASIC; new NoC IP solutions; formal verification for C++ designs EDA Cafe “Baya’s NoC IP – Startup Baya Systems has
NewElectronics: Baya Systems looks to transform SoCs and Chiplets for emerging Applications
Baya Systems looks to transform SoCs and Chiplets for emerging Applications via NewElectronics Baya Systems has emerged from stealth mode and has
Electronics Weekly: Tenstorrent licenses Baya’s WeaveIP
Tenstorrent licenses Baya’s WeaveIP via ElectronicsWeekly.com “Baya Systems provides single-die or multi-die, chiplet-ready systems for Intelligent Compute. Its WeaverPro software and WeaveIP
Electronic Product Design and Test: Software/IP Aids Sophisticated SoC Development
Software/IP Aids Sophisticated SoC Development via Electronic Product Design and Test (EPDT) Californian start-up Baya Systems has just announced the 1st offerings
EETimes: Startup Emerges from Stealth to Address Chiplet Design Complexity
Startup Emerges from Stealth to Address Chiplet Design Complexity via EETimes Baya Systems is coming out of stealth mode to take the
eeNews Europe: Baya Systems emerges from Stealth with Chiplet Interconnect
Baya Systems emerges from Stealth with Chiplet Interconnect via eeNews Europe Baya Systems has emerged from stealth with an interconnect tool for
