Source: GSA USEF 2026
Baya Systems is proud to return as the official Wi-Fi Sponsor of the 2026 GSA U.S. Executive Forum (USEF), bringing together more than 150 semiconductor executives and industry leaders in Menlo Park to exchange perspectives on the forces shaping the future of compute. As AI systems grow more powerful and architectures become increasingly complex, efficient data movement and connectivity are becoming fundamental to scaling performance, power efficiency, and system design. We look forward to joining the conversation and connecting with customers, partners, and industry peers at this year’s forum.
Date & Location
- September 22, 2026
- Menlo Park, CA
Why This Matters
USEF creates a focused setting for semiconductor leaders to discuss the technologies, business priorities, and ecosystem shifts defining the industry’s next chapter. This year’s program explores topics including AI-driven design, next-generation connectivity, hyperscaler requirements, the energy demands of advanced compute, and the growing pressure to deliver more capable silicon faster. These challenges are closely connected to Baya’s mission: helping semiconductor teams move data efficiently across increasingly complex silicon, chiplet, and system architectures, while accelerating the path from architecture to implementation.
Connect with Baya at USEF
If you’ll be at USEF, connect with the Baya team to discuss your AI, chiplet, interconnect, and system architecture challenges, or to explore opportunities to collaborate.
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