EDA Cafe: Solving AI's Biggest Challenge
Joint solution reduces risk and accelerates time-to-silicon for advanced semiconductor platforms
via EDA Cafe: As AI scales, data movement and connectivity have become the biggest challenges. Baya Systems is addressing this with IP subsystems that optimize high-performance, scalable AI systems. In a recent EDA Cafe interview, CEO Sailesh Kumar discusses how Baya’s software-driven interconnect solutions are enabling efficient, high-bandwidth AI architectures. With Series A and B funding secured and products in customer deployments, Baya is driving the future of chiplet-based design with UALink and UCle support.
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