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As we head into the holiday season (and prepare for Thanksgiving with our readers in the U.S.) we’re excited to share a packed November edition of the Baya Systems newsletter. This month, we’re highlighting major industry conversations, from Jim Keller’s perspective on open intelligence, to the rapidly evolving landscape of AI infrastructure and interconnect standards. We’re also recapping key events, thought-leadership moments, and a special milestone: Baya being recognized as Andes Technology’s Partner of the Year. It’s a great moment to pause, reflect, and catch up on everything driving the future of scalable AI and system design.
Enjoy the read!
Baya hosted a happy hour last month with partners, customers, and friends from across the RISC-V ecosystem, creating a great space for conversation and connection. The event brought together engineers, innovators, and collaborators who enjoyed a relaxed moment after a full day at the RISC-V Summit. Thank you to everyone who joined us and helped make it such a warm, energizing gathering. Looking forward to many more moments like this as we grow the community together.
We joined the OCP Global Summit last month, where Baya’s Chief Solutions Architect Saurabh Gayen presented “AI Scaling with NeuraScale High-Radix Switches,” highlighting how Baya’s next-gen fabric enables low-latency, high-density scaling for AI systems. We also participated in the Innovation Village, showcasing our software-driven, chiplet-ready interconnect technologies and connecting with system architects and hyperscalers across the OCP community.
In this episode of TechThreads: Weaving the Intelligent Future, legendary chip architect Jim Keller joins Nandan Nayampally to discuss how openness, modularity, and simplicity are reshaping the architecture of intelligence. From breaking down complex systems into scalable, composable layers to the growing role of data movement, chiplets, and software-driven fabrics, Jim offers a clear view of where AI and compute are heading.
You can now tune in to Baya’s podcasts on a variety of platforms, so you can listen wherever, whenever works best for you! Don’t miss out on the latest insights and conversations from the world of innovation.
In this blog, Baya’s CCO Nandan Nayampally reflects on the major OpenAI–AMD partnership and what it really tells us about where AI infrastructure is headed. With OpenAI securing 6 GW of new build capacity, he explains that the industry’s focus is shifting from chasing ever-bigger chips to rethinking how entire systems move, connect, and scale data. It’s a story about why the next leap in AI performance won’t come from compute alone, but from the invisible highways between it, and how Baya is helping build them.
In his latest piece, Saurabh Gayen, Baya’s Chief Solutions Architect, takes us inside the emerging battle for AI infrastructure supremacy, comparing interconnect standards like ESUN, UALink, NVLink, and PCIe. He explains why simply stacking more compute isn’t enough anymore: the real fight happens in how you move data, connect accelerators, and build systems that scale without breaking.
Baya Systems is excited to take part in this year’s EE Times AI Everywhere Virtual Event, contributing to two sessions focused on building AI systems that scale efficiently and sustainably.
Panel: “Beyond the Reticle – Chiplet Architectures for the GenAI Era”
Leaders from across the industry, moderated by Sally Ward-Foxton, will discuss how chiplets are transforming data center design as we move past monolithic limits.
When: Dec 10, 2025 | 1:05 PM CST
Where: Virtual
Session: “Accelerating Inference at Scale, Densification, and Tokens per Watt”
Baya’s CCO Nandan Nayampally will offer insights into why data movement and system densification now define AI performance and how software-driven, chiplet-ready fabrics unlock real efficiency from edge to cloud.
When: Dec 10, 2025 | 2:35 PM CST
Where: Virtual
Baya Systems continues to gain industry recognition. Check out our latest features in:
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