Baya Systems Collaborates with Tenstorrent to demonstrate Optimized Subsystem for TT-Ascalon™ Processors, Joins OCA Ecosystem
Santa Clara, Calif. – September 25, 2025 — Baya Systems, a leader in software-driven, chiplet-ready fabric IP for scalable AI and high-performance computing, today announced two key milestones: successful interoperability between Baya’s WeaveIP™ fabric and Tenstorrent’s TT- Ascalon™ processor portfolio and becoming one of the first members of Tenstorrent’s Open Chiplet Atlas™ Architecture (OCAA). Both companies are actively working on leveraging the unique advantages of Baya’s fabric interoperability within OCA. Together, these milestones underscore their shared vision and commitment to enabling flexible, scalable, and customizable compute systems designed for the next generation of AI and other high-performance applications.
By integrating Baya’s chiplet-ready interconnect IP with Tenstorrent’s RISC-V-based Ascalon cores, system architects can now design and deploy compute platforms that are optimized end-to-end, from core to chiplet to system level. The collaboration brings to life a common vision: agile, software-driven development, optimization, and deployment of state-of-the-art systems.
Tenstorrent and Baya have jointly published a white paper with results that illustrate the performance, configurability, and scalability of this combined scalable compute solution. Building on the white paper on AI fabrics that the companies published in June, the two companies demonstrate how the WeaveIP fabric extends its technical leadership and versatility. Ascalon cores deliver best-in-class performance, both peak and per watt, while Baya’s WeaveIP fabric enables a data-driven system optimization to meet customer needs and dynamically adapt to Tenstorrent’s application requirements, ensuring future-proof scalability. The interoperability demos highlight how customers can design customized compute systems with faster time-to-market and reduced risk. Request a demo to explore how this solution can accelerate your designs.
Tenstorrent is a leader in driving the RISC-V and AI processing ecosystems and has collaborated with Baya Systems on enabling designers to rapidly innovate and bring ground-breaking silicon platforms to market.
“Tenstorrent is redefining processor architectures for the AI age, and Baya is redefining system interconnects and system design paradigms. Together, we are enabling customers to weave scalable compute systems from proven, interoperable building blocks,” said Dr. Sailesh Kumar, CEO of Baya Systems. “This is a major step toward our mission of democratizing hyper-efficient, data-centric SoC and multi-chiplet design.”
Baya Systems is leading the next wave of foundational, high-performance, and modular semiconductor systems technologies that are chiplet-ready and accelerate intelligent compute everywhere. Inspired by the baya bird’s nest-weaving ability, Baya integrates best-in-class compute, communication, and I/O components into seamless, energy-efficient solutions. Its software-based design and exploration platform enhances performance, yield and reusability, enabling cutting-edge, cost-effective innovation across multiple industries. A member of the EE Times 2025 Silicon 100 and recipient of Frost & Sullivan’s 2025 Technology Innovation Leader award in semiconductor IP interconnect, Baya is backed by leading investors including Matrix Partners, Maverick Silicon, Synopsys Inc., and Intel Capital. For more information, visit Bayasystems.com or follow us on LinkedIn.
At Tenstorrent, we build computers for AI, and the developers that are shaping its future. Our high-performance RiscV based CPUs and AI, modular chiplets, and scalable compute systems give developers full control, at any scale from a single-node experimentation to data center-scale deployment.
We believe in an open future. Our architecture and software are designed to be edited, forked, and owned. Our team of engineers, dreamers, and first-principle thinkers is redefining how hardware and software converge to accelerate innovation.