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Baya Systems has been honored with Frost & Sullivan’s 2025 Global Technology Innovation Leadership award in the Semiconductor IP Interconnect Solutions category, recognizing our unified chiplet fabric architecture, AI/HPC optimized scalability, and a platform centric design flow that’s reshaping modular computing. With a strong culture of collaboration, bi weekly hackathons, and a royalty-based pricing model closely tied to customer success, we’ve demonstrated powerful business impact and operational agility. This recognition highlights not just our technology leadership but our commitment to customer-first innovation and strategic growth as AI-driven architectures dominate the landscape.
At DAC 2025 (June 23–25, San Francisco), Baya Systems took center stage showcasing our software-defined fabric and sharing key insights on chiplet scalability, AI-driven EDA, and unified interconnect architectures. Our CEO and CCO headlined the EE Times Chiplet Pavilion, and in this compelling EE Times video, Dr. Sailesh Kumar breaks down how Baya’s tech addresses exponential growth in data movement, hits performance at scale, and fuels the emerging chiplet economy.
Tune in for a quick interview that highlights why Baya is helping shape the future of AI acceleration and chiplet-based system design.
In Episode 4 of Tech Threads: Weaving the Intelligent Future, CCO Nandan Nayampally and Enfabrica founder Rochan Sankar tackle one of AI’s most critical challenges: data movement at scale. They dig into emerging system architectures, optical interconnects, chiplet innovation, and the software-defined fabrics that enable truly intelligent, scalable AI systems. With candid startup lessons and bold predictions, this episode delivers both technical depth and strategic vision, offering engineers, architects, and technology leaders a fascinating perspective for overcoming infrastructure bottlenecks and building next-gen compute systems.
You can now tune in to Baya’s podcasts on a variety of platforms—so you can listen wherever, whenever works best for you! Don’t miss out on the latest insights and conversations from the world of innovation.
Missed us at DAC 2025? Now’s your chance to hear directly from Baya’s leadership, wherever you are in the world. Tune in as CCO Nandan Nayampally joins the “Developing the Chiplet Economy” panel to explore commercialization challenges, ecosystem collaboration, and interface standards shaping the future of modular design. And CEO Dr. Sailesh Kumar leads the session “Unleashing Scale Through Chiplets,” diving into how Baya’s modular IP and smart fabrics are enabling scalable AI, from edge to cloud. If you’re navigating challenges in latency, power, or system integration, these talks offer a front-row look at what’s next in chiplet-based design.
To stay updated on upcoming engagements and industry insights, subscribe to Baya Systems’ newsletter or visit the events page on our website.
Helma Zargarian, Baya’s Director of Operations, Honored in 40 Under 40
Baya Systems’ rising star, Helma, has been honored as one of Silicon Valley Business Journal’s 2025 40 Under 40, and it’s a win for the whole team. In her feature “I Made the 40 Under 40 List — But This Is Really About Baya,” Helma credits this achievement to Baya’s meritocratic, high-performance culture. Baya empowers employees to “move mountains” and outperform organizations three times its size. Curious how our culture fuels innovation and heartfelt leadership? Click to dive in!
Chiplet Marketplace – Baya Systems Celebrates First Year of Hypergrowth After Emerging from Stealth
Semi IP Hub: Baya Systems Celebrates First Year of Hypergrowth After Emerging from Stealth
Cambiarn-AI Research: Scale-within, Scale-up and Scale-out Fabrics Enable Efficient AI Acceleration
EETimes: DAC 2025: Agentic AI In EDA Is Just Getting Started, And Chiplets Are All The Rage
Electronics Weekly: Switch fabric scales up data movement for AI
