Scaling AI

Baya’s Breakout Year: Customer Growth, Awards, and What’s Next for AI Fabric

From celebrating one year out of stealth to earning industry honors and driving key conversations around chiplets and AI scalability, last month had a series of milestones for Baya Systems. In this issue, catch up on our latest customer growth, award recognitions, event highlights, and expert insights from our executive team. Whether you missed us at DAC last month, or are tuning in virtually from around the world, we’ve got fresh perspectives, powerful partnerships, and forward-thinking innovation to share.

One Year Out of Stealth, And Scaling Fast

Stealth to Scale

From stealth mode to center stage, Baya Systems just marked its first year with explosive momentum: 5x growth in design wins, a $36.5M Series B, and a rapidly expanding global footprint. With our modular, chiplet-ready system IP and breakthrough smart switching fabric, NeuraScale™, we’re powering next-gen AI infrastructure with speed, scale, and simplicity. Backed by partners like Synopsys, Intel Capital, and Tenstorrent, Baya is redefining what’s possible in AI compute. 

Baya Awarded Frost & Sullivan
Global Technology Innovation Leadership

Baya Systems has been honored with Frost & Sullivan’s 2025 Global Technology Innovation Leadership award in the Semiconductor IP Interconnect Solutions category, recognizing our unified chiplet fabric architecture, AI/HPC optimized scalability, and a platform centric design flow that’s reshaping modular computing. With a strong culture of collaboration, bi weekly hackathons, and a royalty-based pricing model closely tied to customer success, we’ve demonstrated powerful business impact and operational agility. This recognition highlights not just our technology leadership but our commitment to customer-first innovation and strategic growth as AI-driven architectures dominate the landscape. 

Tech Innovation

Tenstorrent Supercharges AI with Baya’s Fabric

Baya X Tenstorrent

Baya is powering Tenstorrent’s next-generation AI and RISC-V compute with our WeaveIP™ and WeaverPro™ fabric technology delivering up to 66% increase in throughput and a 50% reduction in silicon area. By integrating Baya’s modular, chiplet-ready interconnect, Tenstorrent gains a leaner, faster, and more scalable architecture that dramatically improves time-to-market and total cost of ownership. The collaboration marks a major milestone in enabling high-performance, fabric-centric design for the AI era.

Inside DAC 2025: Chiplets, AI Scalability & Baya’s Vision 

At DAC 2025 (June 23–25, San Francisco), Baya Systems took center stage showcasing our software-defined fabric and sharing key insights on chiplet scalability, AI-driven EDA, and unified interconnect architectures. Our CEO and CCO headlined the EE Times Chiplet Pavilion, and in this compelling EE Times video, Dr. Sailesh Kumar breaks down how Baya’s tech addresses exponential growth in data movement, hits performance at scale, and fuels the emerging chiplet economy.

Tune in for a quick interview that highlights why Baya is helping shape the future of AI acceleration and chiplet-based system design.

Tech Threads Episode 4:

Beyond the Bottlenecks. A Vision for Intelligent Systems

In Episode 4 of Tech Threads: Weaving the Intelligent Future, CCO Nandan Nayampally and Enfabrica founder Rochan Sankar tackle one of AI’s most critical challenges: data movement at scale. They dig into emerging system architectures, optical interconnects, chiplet innovation, and the software-defined fabrics that enable truly intelligent, scalable AI systems. With candid startup lessons and bold predictions, this episode delivers both technical depth and strategic vision, offering engineers, architects, and technology leaders a fascinating perspective for overcoming infrastructure bottlenecks and building next-gen compute systems.

You can now tune in to Baya’s podcasts on a variety of platforms—so you can listen wherever, whenever works best for you! Don’t miss out on the latest insights and conversations from the world of innovation.
Beyond the Bottleneck

Upcoming Events

EE Times Chiplets

Missed us at DAC 2025? Now’s your chance to hear directly from Baya’s leadership, wherever you are in the world. Tune in as CCO Nandan Nayampally joins the “Developing the Chiplet Economy” panel to explore commercialization challenges, ecosystem collaboration, and interface standards shaping the future of modular design. And CEO Dr. Sailesh Kumar leads the session “Unleashing Scale Through Chiplets,” diving into how Baya’s modular IP and smart fabrics are enabling scalable AI, from edge to cloud. If you’re navigating challenges in latency, power, or system integration, these talks offer a front-row look at what’s next in chiplet-based design.

To stay updated on upcoming engagements and industry insights, subscribe to Baya Systems’ newsletter or visit the events page on our website.

Latest Baya Blogs

Helma Zargarian, Baya’s Director of Operations, Honored in 40 Under 40

Baya Systems’ rising star, Helma, has been honored as one of Silicon Valley Business Journal’s 2025 40 Under 40, and it’s a win for the whole team. In her feature “I Made the 40 Under 40 List — But This Is Really About Baya,” Helma credits this achievement to Baya’s meritocratic, high-performance culture. Baya empowers employees to “move mountains” and outperform organizations three times its size. Curious how our culture fuels innovation and heartfelt leadership? Click to dive in!

Blog by Helma

Baya Systems in the News

Newsroom

Baya’s momentum is making headlines. From our first year of hypergrowth to our role in scaling AI through smart fabrics and chiplet architectures, leading industry publications are recognizing the impact we’re making across the semiconductor landscape.

  • Semiconductor Engineering – Baya Systems: Moving Data Faster

  • Chiplet Marketplace – Baya Systems Celebrates First Year of Hypergrowth After Emerging from Stealth

  • Semi IP HubBaya Systems Celebrates First Year of Hypergrowth After Emerging from Stealth

  • Cambiarn-AI ResearchScale-within, Scale-up and Scale-out Fabrics Enable Efficient AI Acceleration

  • EETimesDAC 2025: Agentic AI In EDA Is Just Getting Started, And Chiplets Are All The Rage

  • Electronics WeeklySwitch fabric scales up data movement for AI  

Join our Team

We are hiring! With rapid growth, we’re expanding our engineering (software and hardware) and commercial teams. We encourage you to explore opportunities and join the team.

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