Baya Systems at DAC 2025
Inside DAC 2025
DAC 2025 brought together innovators from across the semiconductor landscape to discuss the next wave of breakthroughs in AI-driven design, chiplet integration, and sustainable system architectures. Held at the Moscone Center, the event was a convergence of engineering minds exploring how to scale innovation efficiently and intelligently.
- Agentic AI tools for chip design automation
- Chiplet and multi-die system integration
- UCIe standardization and ecosystem momentum
- Focus on energy-efficient, scalable design
Our Presence, Our Voice
At Booth 2430, Baya engaged directly with system architects and chip designers to showcase how our software-driven fabric IP delivers modularity, efficiency, and scale for AI, HPC, and automotive applications. Our story resonated with those seeking pragmatic, forward-looking chiplet solutions. Coming off a year of rapid growth and ecosystem traction, our presence at DAC underscored the momentum behind our platform, and the market’s readiness for chiplet-ready innovation.
Baya’s Momentum Is Building
As industry demand for scalable, chiplet-based solutions grows, Baya continues to accelerate. In just over a year out of stealth, our IP is already in development with top-tier AI system providers and gaining recognition across the ecosystem, from partnerships to analyst interest and media coverage. Our solutions tackle the growing challenge of efficient data movement across dies and domains, enabling performance at scale without sacrificing power or latency. DAC 2025 was a powerful validation point: our solutions are timely, our vision is resonating, and our momentum is unmistakable.
- Active engagements with leading AI and data center innovators
- Multiple customer deployments already underway
- Growing visibility across events, media, and partner networks
Want to learn more about our journey since emerging from stealth? Read our Momentum press release to see highlights from our first year of hypergrowth.
Advancing the Chiplet Ecosystem
Panel: Developing the Chiplet Economy
With participation from Baya’s CCO, Nandan Nayampally, this panel explored the essential ingredients for a thriving chiplet marketplace, from open standards and interface protocols to verification tools and vendor collaboration.
Talk: Unleashing Scale Through Chiplets
CEO Dr. Sailesh Kumar highlighted how Baya’s IP and system-level design approach support chiplet deployment in real-world AI and data-intensive environments.
Industry Buzz Around Baya
- EETimes: https://www.eetimes.com/dac-2025-agentic-ai-in-eda-is-just-getting-started-and-chiplets-are-all-the-rage/
- Semi IP Hub: https://semiiphub.com/news/baya-first-year-of-hypergrowth
- Chiplet Marketplace: https://chiplet-marketplace.com/news/baya-systems-first-year-anniversary
- Electronics Weekly: https://www.electronicsweekly.com/news/products/software-products/switch-fabric-scales-up-data-movement-for-ai-2025-06/
- Semiconductor Engineering: https://semiengineering.com/baya-systems-moving-data-faster/
