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Press Releases

Baya Systems Revolutionizes AI Scale-Up and Scale-Out with NeuraScale™ Fabric

Baya Systems and Semidynamics Collaborate to Accelerate RISC-V System-on-Chip Development

Baya Systems Welcomes Manish Muthal and Siva Yerramilli to Board of Directors

Baya Systems Raises $36M+ to Propel AI and Chiplet Innovation

Baya Systems Expands Through Partnership with IPro Silicon IP Ltd.

Baya Systems And Blue Cheetah Partner To Deliver Chiplet Interconnect Solutions

Tenstorrent Licenses Baya Systems’ Fabric into next generation AI and Compute Chiplet Solutions

Baya Systems Introduces New Technology to Transform and Accelerate Intelligent Computing

In the News

Embedded World 2025 – Baya Systems Intro with Nandan Nayampally

Baya Systems AI-optimized chiplet interconnects at Embedded World 2025 WeaverPro, WeaveIP RISC-V HPC

Baya Systems New NeuraScale Upscales Traditional Switching Architectures

Baya’s NeuraScale Fabric Sees 100x AI Chiplet Boost

EDA Cafe: Solving AI’s Biggest Challenge

citybiz: Q&A with Nandan Nayampally, CCO of Baya Systems

The Volt Post: Developing the Framework of Chiplet Economy

Baya Systems: Breaking the AI Data Bottleneck

Investors Hangout: Baya Systems Secures $36M to Innovate AI and Chiplet Technologies

EPDT News: Industry Veterans Join Baya Systems

VC News Daily: Baya Systems Secures $36M+ Series B Round

eeNews Europe: Baya Systems raises $36m for Chiplet Tech

EETimes: A Week of Chiplet Traction

Converge Network Digest: Baya Systems Raises $36M to Drive AI and Chiplet Innovations

Embedded.com: Baya Systems Raises $36M to Accelerate Intelligent Compute with Chiplet Technology

VentureBeat: Baya Systems raises $36M for AI and Chiplet Innovation

Semiconductor Engineering: Barriers To Chiplet Sockets (Part 3)

Semiconductor Engineering: What Comes After HBM For Chiplets (Part 2)

Semiconductor Engineering: Defining The Chiplet Socket (Part 1)

Electronics Engineering Journal: Weaving State-of-the-Art Chiplet and SoC Fabrics

EDA Cafe: Transformer-specialized ASIC; new NoC IP solutions; more

NewElectronics: Baya Systems looks to transform SoCs and Chiplets for emerging Applications

Electronics Weekly: Tenstorrent licenses Baya’s WeaveIP

Electronic Product Design and Test: Software/IP Aids Sophisticated SoC Development

EETimes: Startup Emerges from Stealth to Address Chiplet Design Complexity

eeNews Europe: Baya Systems emerges from Stealth with Chiplet Interconnect

Newsletters

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Industry Momentum and Expansion

2025: Starting the Year Strong

2024 Reflection: ​A Milestone Year

Welcome to the Inaugural Edition

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