EPDT News: Industry Veterans Join Baya Systems
Home / EPDT News: Industry Veterans Join Baya Systems EPDT News: Electronic Product Design & Test covered Baya Systems’ continued growth as we welcome Manish Muthal (Maverick Silicon) and Siva K. Yerramilli (Synopsys) to our Board of Directors following our successful Series B funding round. Their expertise will be instrumental as we scale and drive […]
VC News Daily: Baya Systems Secures $36M+ Series B Round
Home / VC News Daily: Baya Systems Secures $36M+ Series B Round VC News Daily: This article highlights how Baya Systems’ Series B funding, led by Maverick Silicon with support from Synopsys, Matrix Partners, and Intel Capital, will enable the team to drive innovation in chiplet-ready semiconductor technologies. Read the full article HERE Latest News Baya Systems […]
eeNews Europe: Baya Systems raises $36m for Chiplet Tech
Home / eeNews Europe: Baya Systems raises $36m for Chiplet Tech eeNews Europe: Baya Systems in the US has raised $36m for its chiplet technology just six months after emerging from stealth mode with backing of $11m. The company launched in June 2024 having raised $11m in a Series A round according to Pitchbook. Baya’s WeaverPro software generates […]
EETimes: A Week of Chiplet Traction
Home / EETimes: A Week of Chiplet Traction EETimes: In this article, Nitin Dahad rounds up a week of inbox filling chiplet news, including Baya Systems’ $36M Series B raise and more on how this funding will propel and ignite growth both operationally and in product development and R&D. Read the full article HERE Latest News […]
Converge Network Digest: Baya Systems Raises $36M to Drive AI and Chiplet Innovations
Home / Converge Network Digest: Baya Systems Raises $36M to Drive AI and Chiplet Innovations Converge Network Digest: In this article, Converge Network Digest highlights Baya Systems’ recent $36 million Series B funding round. This funding will accelerate the development and deployment of Baya’s software-driven IP technology, addressing the growing demand for system-on-chip (SoC) designs and […]
Embedded.com: Baya Systems Raises $36M to Accelerate Intelligent Compute with Chiplet Technology
Home / Embedded.com: Baya Systems Raises $36M to Accelerate Intelligent Compute with Chiplet Technology Embedded.com: A recent interview with Nandan Nayampally, Baya Systems CCO, on the Series B raise, Baya’s growth trajectory and the visionary leadership that brought Baya Systems from vision to reality. “The story of Baya’s inception which started with a key phone call […]
VentureBeat: Baya Systems raises $36M for AI and Chiplet Innovation
Home / VentureBeat: Baya Systems raises $36M for AI and Chiplet Innovation VentureBeat: In this newly published article, VentureBeat Lead Writer, Dean Takahashi, takes a deep dive into Baya Systems’ Series B funding announcement, along with the investor breakdown and how this raise will propel innovation, growth and more. Read the full article HERE Latest News Baya […]
Semiconductor Engineering: Barriers To Chiplet Sockets (Part 3)
Home / Barriers To Chiplet Sockets (Part 3) Semiconductor Engineering In Part Three of Semiconductor Engineering’s Experts at the Table series, industry leaders dive into the challenges slowing chiplet commercialization. In this final segment, Sailesh Kumar, CEO of Baya Systems, joins experts from Blue Cheetah, Marvell, Samsung, and Synopsys to explore the barriers to broader chiplet adoption. […]
Semiconductor Engineering: What Comes After HBM For Chiplets (Part 2)
Home / What Comes After HBM For Chiplets (Part 2) Semiconductor Engineering In Part Two of the Experts at the Table series, leaders from Baya Systems, Marvell, Samsung, Synopsys, and Blue Cheetah Analog Design delve into the evolving landscape of chiplet commercialization. With demand for chiplets on the rise, the industry faces a key question: Will commercialization […]
Semiconductor Engineering: Defining The Chiplet Socket (Part 1)
Home / Defining The Chiplet Socket (Part 1) Semiconductor Engineering “Experts At The Table: The semiconductor industry has been buzzing with the possibilities surrounding chiplets, but so far this packaging technology has been confined to large semiconductor companies that are vertically integrated. The industry has been attempting to open this up to a broader group […]