As AI and chiplet-based systems scale, efficient implementation across increasingly complex architectures becomes critical to bringing designs to silicon. Strengthening our leadership in chiplet engineering and silicon enablement is critical to helping our partners move from concept to silicon faster and with greater confidence.
Joji Philip steps into the role of SVP of IP Engineering, where he leads IP architecture, roadmap, and delivery. In this role, Joji is focused on scaling Baya’s IP portfolio to meet the demands of next-generation systems and chiplet-based designs, ensuring high-quality, reusable, and system-aligned solutions.
Baya Systems is leading the next wave of foundational, high-performance, and modular semiconductor systems technologies that are chiplet-ready and accelerate intelligent compute everywhere. Inspired by the baya bird’s nest-weaving ability, Baya integrates best-in-class compute, communication, and I/O components into seamless, energy-efficient solutions. Its software-based design and exploration platform enhances performance, yield and reusability, enabling cutting-edge, cost-effective innovation across multiple industries. A member of the EE Times 2025 Silicon 100 and recipient of Frost & Sullivan’s 2025 Technology Innovation Leader award in semiconductor IP interconnect, and winner of the 2025 EPDT Product of the Year Award, Baya is ISO 9001:2015 certified and backed by leading investors including Matrix Partners, Maverick Silicon, Synopsys Inc., and Intel Capital. For more information, visit https://bayasystems.com or follow us on LinkedIn.