New computational platforms are needed to address the challenges of advanced AI and machine learning in market segments such as data centers, infrastructure, automotive and edge IoT applications. To keep pace with technology advancements, these platforms must balance processing power with efficient data movement. As AI, ML and HPC workloads grow exponentially and systems shift to larger scales and chiplets, the focus is shifting from raw compute power to efficient data transfer between processors and chiplets.
“Our customers need high-performance compute that doesn’t get bottlenecked by inefficient data transport,” said Roger Espasa, CEO of Semidynamics. “Partnering to pre-integrate with Baya Systems’ WeaveIP technology accelerates development timelines for our mutual customers, eliminating this bottleneck and enabling a new level of performance for AI and HPC applications.”