From embedded world 2025: A Faster Lane to Smarter Systems
by Nandan Nayampally
Returning to embedded world 2025 in Nuremberg after a brief hiatus was electric. The energy around AI acceleration, chiplet-driven innovation, and system-level design was unmistakable—and intensifying. For us at Baya Systems, it wasn’t just another trade show. It marked our first major global presence since launching out of stealth at DAC 2024—and it came on the heels of our NeuraScale™ product debut just a week earlier.
In true Baya fashion, we focused on speed, efficiency and cost-effectiveness —not only in what we build, but how we show up. Startup City was the perfect launchpad, placing us among more than a hundred emerging companies. Positioned right across from Axelera’s high-energy booth, our location drove strong traffic, deep engagement, and maximum visibility with lean spend.
Smarter AI at the Edge
AI is no longer a buzzword—it’s embedded. Literally. Models with billions of parameters are now running on compact edge devices, trading cloud latency for local intelligence. Arm’s new platform and Raspberry Pi demos drew big crowds, while RISC-V showed up everywhere powering scalable edge use cases.
Our unified chiplet and interconnect solutions felt right at home in this context. WeaveIP™ and WeaverPro™ offer the scalable fabrics and software intelligence needed to build next-gen AI systems—from edge inference to in-vehicle compute.
Infrastructure on Silicon
Beyond the car, infrastructure integration was a clear theme. V2X systems and real-time connectivity are redefining bandwidth and latency expectations—not just on roads but inside chips. The move toward intelligent routing, redundancy, and energy-aware data movement is accelerating, and we’re proud to be enabling that transformation.
Collaborations that Matter
One of the highlights was unveiling our collaboration with Semidynamics, an innovative AI company that is changing the paradigm. By combining their customizable RISC-V cores, and AI compute engines with our high-efficiency WeaveIP NoC and analytics-driven WeaverPro platform, we’re enabling fast, flexible SoC design tailored to real-world workloads—not just benchmarks. From data center to automotive ADAS and edge/IoT, we’re helping teams go from concept to silicon smarter and faster.
System Design, Reinvented
We also saw strong interest in smarter design methodologies. Platforms like Renesas 365 are pushing cloud-native development. At Baya, we take a complementary approach—integrating with existing flows while offering system-level visibility through our software platform. It’s not about handing off IP and stepping back; it’s about co-optimizing PPA in the context of actual performance and behavior.
Scaling with Purpose
If embedded world 2025 showed us anything, it’s that speed matters—but so does purpose. The next wave of AI and semiconductor growth will be driven by scalable chiplets, open standards, and intelligent design platforms. With over $36M raised in Series B funding—backed by leaders like Synopsys, Matrix Partners, and Intel Capital—we’re doubling down on this mission.
To everyone we met—thank you. Your feedback reinforced our direction and sparked new ideas we’re already acting on. The future of AI is being built today, and at Baya, we’re proud to be in the fast lane.
Built for speed. Engineered for intelligence.
