Join Baya Systems at the 3rd Annual Chiplet Summit

The third annual Chiplet Summit takes place January 21–23, 2025, at the Santa Clara Convention Center, bringing together industry leaders to discuss the transformative role of chiplets in semiconductor innovation. With all major chip makers adopting chiplet designs to push the boundaries of leading-edge nodes, this year’s summit focuses on critical topics such as AI/ML acceleration, the open chiplet economy, advanced packaging methods, die-to-die interfaces, and collaboration with foundries.

Don’t miss Baya Systems CCO, Nandan Nayampally, as he joins the panel discussion “Best Way to Optimize Chiplets” on January 22, from 5–6 p.m. Explore how chiplet technology is shaping the future of high-performance devices and network with the experts driving this change.