Embracing the Future of Computing: The Era of Unprecedented Data Movement
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Semiconductor Engineering: What Comes After HBM For Chiplets (Part 2)
What Comes After HBM For Chiplets (Part 2)  Semiconductor Engineering  In Part Two of the Experts at the Table series, leaders from Baya
2024 OCP Global Summit October 15 – 17
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Semiconductor Engineering: Defining The Chiplet Socket (Part 1)
Defining The Chiplet Socket (Part 1)  Semiconductor Engineering  “Experts At The Table: The semiconductor industry has been buzzing with the possibilities
Electronics Engineering Journal: Weaving State-of-the-Art Chiplet and SoC Fabrics
Weaving State-of-the-Art Chiplet and SoC Fabrics  Electronics Engineering Journal  “To address the needs of artificial intelligence and data center type
Updated Presentation REPLAY – Chiplets: Building the Future of SoCs July 24 & 25
Chiplets: Building the Future of SoCs Conference Presentation Baya Systems Founder and CEO, Sailesh Kumar presented at the “Chiplets: Building
A Chiplet-Optimized Unified Fabric Interconnect Solution
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EDA Cafe: Transformer-specialized ASIC; new NoC IP solutions; more
Transformer-specialized ASIC; new NoC IP solutions; formal verification for C++ designs  EDA Cafe “Baya’s NoC IP – Startup Baya Systems has emerged
NewElectronics: Baya Systems looks to transform SoCs and Chiplets for emerging Applications
Baya Systems looks to transform SoCs and Chiplets for emerging Applications via NewElectronics Baya Systems has emerged from stealth mode and has
Electronics Weekly: Tenstorrent licenses Baya’s WeaveIP
Tenstorrent licenses Baya’s WeaveIP via ElectronicsWeekly.com  “Baya Systems provides single-die or multi-die, chiplet-ready systems for Intelligent Compute. Its WeaverPro software and Weave
