Embracing the Future of Computing: The Era of Unprecedented Data Movement
Embracing the Future of Computing: The Era of Unprecedented Data Movement The computing landscape is evolving rapidly, driven by explosive […]
Embracing the Future of Computing: The Era of Unprecedented Data Movement The computing landscape is evolving rapidly, driven by explosive […]
What Comes After HBM For Chiplets (Part 2)  Semiconductor Engineering  In Part Two of the Experts at the Table series, leaders from Baya
2024 OCP Global Summit October 15 – 17 Join us at the 2024 OCP Global Summit, where the brightest minds
Defining The Chiplet Socket (Part 1)  Semiconductor Engineering  “Experts At The Table: The semiconductor industry has been buzzing with the possibilities
Weaving State-of-the-Art Chiplet and SoC Fabrics  Electronics Engineering Journal  “To address the needs of artificial intelligence and data center type
Chiplets: Building the Future of SoCs Conference Presentation Baya Systems Founder and CEO, Sailesh Kumar presented at the “Chiplets: Building
A Chiplet-Optimized Unified Fabric Interconnect Solution Chiplets, the vanguard of semiconductor chip evolution, are revolutionizing the industry by addressing performance
Transformer-specialized ASIC; new NoC IP solutions; formal verification for C++ designs  EDA Cafe “Baya’s NoC IP – Startup Baya Systems has emerged
Baya Systems looks to transform SoCs and Chiplets for emerging Applications via NewElectronics Baya Systems has emerged from stealth mode and has
Tenstorrent licenses Baya’s WeaveIP via ElectronicsWeekly.com  “Baya Systems provides single-die or multi-die, chiplet-ready systems for Intelligent Compute. Its WeaverPro software and Weave