Semiconductor Engineering: Defining The Chiplet Socket (Part 1)
Defining The Chiplet Socket (Part 1) Semiconductor Engineering “Experts At The Table: The semiconductor industry has been buzzing with the […]
Defining The Chiplet Socket (Part 1) Semiconductor Engineering “Experts At The Table: The semiconductor industry has been buzzing with the […]
Weaving State-of-the-Art Chiplet and SoC Fabrics Electronics Engineering Journal “To address the needs of artificial intelligence and data center type
Chiplets: Building the Future of SoCs Conference Presentation Baya Systems Founder and CEO, Sailesh Kumar presented at the “Chiplets: Building
A Chiplet-Optimized Unified Fabric Interconnect Solution Chiplets, the vanguard of semiconductor chip evolution, are revolutionizing the industry by addressing performance
Transformer-specialized ASIC; new NoC IP solutions; formal verification for C++ designs EDA Cafe “Baya’s NoC IP – Startup Baya Systems has
Baya Systems looks to transform SoCs and Chiplets for emerging Applications via NewElectronics Baya Systems has emerged from stealth mode and has
Tenstorrent licenses Baya’s WeaveIP via ElectronicsWeekly.com “Baya Systems provides single-die or multi-die, chiplet-ready systems for Intelligent Compute. Its WeaverPro software and WeaveIP
Baya Systems And Blue Cheetah Partner To Deliver Chiplet Interconnect Solutions SUNNYVALE, Calif., June 23, 2024 — Baya Systems and Blue Cheetah
Software/IP Aids Sophisticated SoC Development via Electronic Product Design and Test (EPDT) Californian start-up Baya Systems has just announced the 1st offerings
Tenstorrent Licenses Baya Systems’ Fabric into next generation AI and Compute Chiplet Solutions SANTA CLARA, Calif., June 21, 2024— Tenstorrent