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technology

Our technology is built ground-up with a software-first, data-driven system development approach.

Key Challenges

The growth of AI and especially generative AI has radically increased compute demand. The compute cost of generative AI search is nearly an order of magnitude higher than a regular search. Any increase in latency of these searches or intelligent recommendation algorithms, can result in billions of dollars in lost revenue. This is creating serious demand for specialized compute, and with it the following challenges:

Growing Complexity

In order to support compute growth and energy costs, the computing paradigm is changing towards specialized compute solutions. This requires much higher integration and transition to chiplets for combining best in class systems. There is a substantial increase in complexity and risk.

Performance and KPI Guarantees

These specialized compute platforms needs very capable and yet very efficient data movement, which means more complex interconnect and the ability to analyze and guarantee performance, latency and other KPIs are becoming increasingly difficult. As you combine multi-chip solutions, this problem increases further.

Costs are Becoming Prohibitive

To hit these complex larger designs, the energy for processing and for data movement is increasing. The silicon footprint is growing, power is increasing which leads to increase cost of silicon and packaging.

Time to Market Window is Shrinking

The rapid acceleration of AI cycles is requiring designers to meet KPIs at first silicon.

How Baya Systems Addresses the Challenges

  • Algorithm-driven, software-based design
  • Scalable and modular IP for all fabric types
  • Multi-level cache coherency
  • Data-driven design with protocol customizability
  • Deep static and dynamic microarchitecture analysis
  • Granular control on fabric wire and logic
  • Unified fabric approach to reduce wire and area cost
  • Workload optimization and post-silicon tuning in the same flow
  • Reduced design time, analysis and development cost
  • Correct-by-construction to reduce risk and iteration
  • Faster design closure and achievement of KPIs
  • Implementation readiness for chiplets and scaling

Technology Overview

Intelligent software-driven, customizable, system IP solutions for efficient, yet unprecedented scale for SoCs and chiplets. Removes guesswork, reduces risk and cost of delivering complex high-performance systems.

Performance
& Scale

description

Performance & Scale

Hyper-efficient transport fabric that can deliver 4 TB/s throughput in a single cluster, and scale to multiple PB/s for multi-chiplet AI applications, and support advanced high-bandwidth memories.

Extreme
Flexibility

description

Extreme Flexibility

The fabric is extremely flexible and can be customized to any topology. It can be extended to custom protocols for innovation in quality-of-service (QoS), debug and more.

Unified
Efficiency

description

Unified Efficiency

Transport is separate from protocol layers, minimizing wires and logic in building a unified fabric that supports coherent, non-coherent, and custom protocols for greatest efficiency with lowest cost and power.

Data-Driven Design

description

Data-Driven Design

Extensive analysis and optimization through software platform enables a fabric that delivers guaranteed performance on target workloads and can be algorithmically optimized for future workloads.

Derisked
System

description

Derisked System

Software-driven development ensures the fabric is correct by construction, and deadlock free with traditional and formal validation, substantially reducing risk for system development.

Modular
Implementation

description

Modular Implementation

The fabric is developed with modular components, improving flexibility and expediting design delivery. It uses physical-design-aware tiling approaches to ease implementation, integration and signoff.

Chiplet-Ready
Network


description

Chiplet-Ready Network

  • Verifiable protocol-level cluster perimeter
  •  Performance and congestion isolation

Chiplet-Ready Cache Coherency

description

Chiplet-Ready Cache Coherency

  • Multi-level cache coherent fabric IP
  • Supports UMA, NUMA or sub-NUMA

Chiplet-Ready
Design Software


description

Chiplet-Ready Design Software

  • Co-optimization of cache, memory, IO stacks
  • Data-driven D2D analysis and optimization

Baya Systems Unified Fabric

The Baya Systems unified fabric provides a common transport supporting multiple protocols and coherency needs within a unified design flow.  Physically-aware solutions can be optimized for power and area while delivering unprecedented performance, low latency and other key performance indicators (KPIs) from concept to deployment.

Optimizations

Design Time
Run Time

Baya Systems Benefits

Metrics

Current Market Challenges

Baya Systems Benefits

Up to 2x smaller fabric

vs standard mesh iso-performance

Up to 3 GHz and 32 PB/s

bisection bandwidth

Lower latency

system and workload dependent

Up to 8 virtual channels

per network, deadlock-free, QoS built-in

8b-2048b channel width

with wide variety of topologies

Data-driven design

and physically-aware implementation