Baya Systems’ technology is being noticed, and we are becoming a voice for the change the industry needs, with leading publications highlighting our role in driving scalable AI and HPC architectures. From being named to EE Times’ Silicon 100 and receiving Frost & Sullivan’s Technology Innovation Leadership Recognition, to being spotlighted in Forbes and selected as one of the Top 13 AI Startups to Bet On, our momentum is accelerating. Explore the latest features, insights, and upcoming events to see how Baya is shaping the future of data movement and system scalability.
Baya Systems has been recognized by EE Times as one of its “Silicon 100: Startups to Watch in 2025”, an annual list spotlighting the most innovative and promising technology companies shaping the future of electronics and compute. The selection reflects Baya’s breakthrough unified AI fabric, strong market potential, and growing industry impact.
Following our earlier announcement, Frost & Sullivan has now officially published the press release recognizing Baya Systems with its 2025 Global Semiconductor IP Interconnect Solutions Technology Innovation Leadership Recognition. The release spotlights our leadership in unified interconnect architecture, our commitment to customer success, and our ability to meet the evolving demands of AI and HPC markets.
Baya Systems has also been named by Justin Kinsey, President of SBT Industries, as one of the “Top 13 AI Startups to Bet On” for 2025. This recognition highlights our growing impact in AI and semiconductor innovation, reinforcing the value of our unified interconnect solutions in addressing the most pressing challenges across AI and HPC markets.
In this episode of Tech Threads, Nandan Nayampally, sits down with Fabrizio Del Maffeo, founder and CEO of Axelera AI, to explore the shift from cloud to edge AI. They unpack critical topics: from power, latency, and cost constraints to regional and use-case nuances, highlighting strategies like digital in-memory computing for low-power, high-throughput inference. Dive deeper into the future of chiplet-based design, open programmable hardware, and the democratization of distributed AI through perspectives on “scale within” and scalable system architectures.
You can now tune in to Baya’s podcasts on a variety of platforms, so you can listen wherever, whenever works best for you! Don’t miss out on the latest insights and conversations from the world of innovation.
If you missed it live, EE Times’ The Future of Chiplets virtual event is now available on demand. Baya Systems joined industry leaders to discuss how chiplet-based design is reshaping scalability, performance, and innovation for AI and HPC systems. Our sessions on developing the chiplet economy and scaling through software-driven interconnects are now available to stream. Don’t miss the chance to catch the insights.
Baya Systems is proud to be part of the AI Infra Summit this September. Join us at Booth #605 on the exhibition floor and tune in on Day 3 (September 11, 2025) for the panel “Systems: RISC-V – Alternative Architectures for Efficient System Scaling,” scheduled from 4:00 PM to 4:40 PM PST. Discover how our unified interconnect solutions are enabling next-level scalability and flexibility across AI and HPC deployments. Don’t miss this opportunity to see how Baya is shaping the future of efficient, modular system architectures.
News Spotlight Forbes: New Fabrics Enable Efficient AI Acceleration
Baya Systems is spotlighted in Forbes in a compelling feature on how new fabrics are enabling efficient AI acceleration. The article delves into how fabrics, not just GPUs, are becoming the critical enabler for high-throughput, low-latency AI systems. Baya’s unified interconnect IP shines as a foundational solution driving scale-within, scale-up, and scale-out performance in AI infrastructure.
We are hiring! With rapid growth, we’re expanding our engineering (software and hardware) and commercial teams. We encourage you to explore opportunities and join the team.
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Meet Baya Systems at the AI Infra Summit
Booth #605 & Panel Feature on RISC-V Architecture
