via EDA Cafe: As AI scales, data movement and connectivity have become the biggest challenges. Baya Systems is addressing this with IP subsystems that optimize high-performance, scalable AI systems. In a recent EDA Cafe interview, CEO Sailesh Kumar discusses how Baya’s software-driven interconnect solutions are enabling efficient, high-bandwidth AI architectures. With Series A and B funding secured and products in customer deployments, Baya is driving the future of chiplet-based design with UL Link and UCIE support.