The company launched in June 2024 having raised $11m in a Series A round according to Pitchbook. Baya’s WeaverPro software generates IP for chiplets using die-to-die (D2D) standards such as Ultra Accelerator Link (UALink). The tool generates a chiplet-ready network with a verifiable protocol level cluster perimeter as well as multi-level cache coherent fabric IP with co-optimization of the cache, memory and IO stacks, all driven by the D2D analysis.