A Time to Skill Up and Scale-up
At Baya Systems, we’ve always believed that groundbreaking technology is built by exceptional people. As we push the boundaries of System on Chip (SoC) fabric design, the need for domain expertise, customer engagement, and scalable execution has never been greater. To meet this challenge, we secured additional funding and strategic partners, then brought in specialists with deep expertise to help us scale to the next level.
Strengthening Product Vision and Partnerships
SoC fabrics are highly complex and vary significantly by use case, making it clear that a strategic approach was necessary for product development, roadmap alignment, and market fit. With the addition of Brian Carlson, a seasoned product management leader with over 3 decades of experience in leading cutting-edge products to market at TI, Intel and NXP, we’re sharpening our ability to translate technical excellence into a clear, scalable product strategy. With Brian’s support, we will more effectively address the evolving needs of hyperscalers, AI accelerators, and other semiconductor innovators. He also heads up Partnerships and Ecosystem, which are fundamental to the success of any IP company.
Enhancing Technical Sales for Deeper Customer Engagement
Baya’s interconnect solutions sit at the heart of next-generation semiconductor systems, and delivering value to customers means understanding their architectural challenges and deployment needs. Gautham Kripalani brings a wealth of experience in technical sales and applications engineering in semiconductors and IP, having helped companies like Imagination and Codasip to scale their operations. Gautham brings this expertise into Baya Systems and is already communicating the power of our technology, building strong customer relationships, and driving faster adoption.
Optimizing Architectures and Scaling up
Interconnect fabric is the unsung hero of modern SoCs, without it, performance bottlenecks emerge, power budgets explode, and scalability suffers. This requires a much greater understanding of systems, performance, and networking. To boost our capabilities, we have added senior experts. One such expert, Saurabh Gayen, our chief solutions architect will work closely with customers to optimize fabric design, optimization, and integration, which is a critical function for enabling our customers to deliver complex solutions from AI and HPC and from Edge to Data Center. He has led processor IP efforts at Intel for more than 15 years.
Bringing Automotive-Grade Innovation to Chip Fabrics
Automotive semiconductors have unique demands – functional safety, real-time performance, and extreme reliability. With AI-driven applications rapidly transforming ADAS, autonomous vehicles, and in-car computing, integrating cutting-edge interconnect solutions has never been more critical. And Alex Palus brings decades of expertise from the frontlines of automotive systems design at TI, Altera/Intel, NXP and AMD. His primary focus is on seamlessly aligning Baya Systems’ technology with the industry’s stringent safety requirements.
Ayan Mandal, also an Intel alumnus, joins us as Principal Performance Architect to strengthen the products and deliver a clearer understanding of system well before it is built.
To add to our development skill and speed, Lal Kumar Budhavarapu and Seeta Rama Raju – have joined us as Directors of Hardware Engineering boosting our design and verification capabilities. Both have extensive experience in networking on, and off chip as well as in advanced AI hardware systems.
Building the Future, One Expert at a Time
Baya Systems has already established itself as the leader in high-performance, chiplet-ready, Network on Chip (NoC) IP, and this team expansion is a natural next step in our journey. As we continue to scale our technology, deepen customer engagement, and enter new markets, these world-class specialists will help us accelerate execution, refine our offerings, and deliver unmatched value to the semiconductor industry.
We couldn’t be more excited to welcome these new team members and look forward to the game-changing innovations they’ll help drive. If you’re as passionate as we are about shaping the future of on-chip interconnects, we’d love to hear from you. Get in touch – contact@bayasystems.com.