Weaving State-of-the-Art Chiplet and SoC Fabrics

via Electronics Engineering Journal  “To address the needs of artificial intelligence and data center type operations, Baya’s software-driven IP technology portfolio is designed to accelerate both complex single-die SoC and multi-die system designs. “People have been working on network-on-chip (NoC) technologies for a long time. One might think that this would give existing NoC technologies an advantage. However, another way of looking at this is that, over time, things that weren’t originally considered get added in (or bolted on). For example, early NoC implementations weren’t conceived with chiplet-based multi-die systems in mind. At some stage, it’s worth taking a step back, starting with a clean slate, and using what’s been learned over the years to come up with a new, streamlined implementation. This is what the folks at Baya Systems have done, resulting in a versatile network that’s been crafted to efficiently transport any protocol and satisfy the performance and physical design requirements of any single-die SoC and chiplet-based multi-die system.”

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