technology
Our technology is built ground-up with a software-defined, data-driven system development approach.
Key Challenges
AI’s growth has surged compute demand, with generative AI search costing nearly ten times more than standard search. Increased latency in searches or recommendation algorithms risks billions in losses, driving demand for efficient, specialized compute with new challenges.
Growing Complexity
To support growing compute demands and energy costs, computing is shifting to specialized solutions with chiplet integration for optimal systems. This increases complexity and risk.
Performance and KPI Guarantees
Specialized computing platforms demand faster and more complex data interconnects, making it tougher to hit performance and latency KPIs, especially in multi-chip designs.
Costs are Becoming Prohibitive
Larger, complex designs increase energy for processing and data movement, expanding silicon footprint and power, raising silicon and packaging costs.
Time to Market Window is Shrinking
The breakneck pace of AI innovation demands designers nail critical KPIs on the first silicon.
How Baya Systems Addresses the Challenges
- Complexity
- Algorithm-based, software-driven fabric design
- Scalable and modular IP for all fabric types
- Multi-level cache coherency
Performance and KPI Guarantees
- Data-driven design with protocol customizability
- Deep static and dynamic microarchitecture analysis
- Granular control on fabric wire and logic
- Costs
- Unified fabric approach to reduce wire and area cost
- Workload optimization and post-silicon tuning in the same flow
- Reduced design time, analysis and development cost
- Time to Market
- Correct by construction to reduce risk and iteration
- Faster design closure and achievement of KPIs
- Implementation readiness for chiplets and scaling
Technology Overview
Smart, customizable system IP solutions that drive unmatched efficiency and scale for SoCs and chiplets. Eliminate guesswork, slash risks, and cut costs while delivering high-performance systems.
Performance
& Scale
Performance & Scale
Hyper-efficient transport fabric that can deliver 4 TB/s throughput in a single cluster, and scale to multiple PB/s for multi-chiplet AI applications, and support advanced high-bandwidth memories.
Extreme
Flexibility
Extreme Flexibility
Unified
Efficiency
Unified Efficiency
Transport is separate from protocol layers, minimizing wires and logic in building a unified fabric that supports coherent, non-coherent, and custom protocols for greatest efficiency with lowest cost and power.
Data-Driven Design
Data-Driven Design
Extensive analysis and optimization through software platform enables a fabric that delivers guaranteed performance on target workloads and can be algorithmically optimized for future workloads.
Derisked
System
Derisked System
Software-driven development ensures the fabric is correct by construction, and deadlock free with traditional and formal validation, substantially reducing risk for system development.
Modular
Implementation
Modular Implementation
Chiplet-Ready
Network
Chiplet-Ready Network
- Verifiable protocol-level cluster perimeter
- Performance and congestion isolation
Chiplet-Ready Cache Coherency
Chiplet-Ready Cache Coherency
- Multi-level cache coherent fabric IP
- Supports UMA, NUMA or sub-NUMA
Chiplet-Ready
Design Software
Chiplet-Ready Design Software
- Co-optimization of cache, memory, IO stacks
- Data-driven D2D analysis and optimization
Baya Systems Unified Fabric
The Baya Systems unified fabric provides a common transport supporting multiple protocols and coherency needs within a unified design flow. Physically-aware solutions can be optimized for power and area while delivering unprecedented performance, low latency and other key performance indicators (KPIs) from concept to deployment.
Unified Fabric Benefits
Metrics
Current Market Challenges
Baya Systems Benefits
- Best Wire Efficiency
Fabric channels in high performance silicon can take up to 20% of die area and power consumption
Up to 2x smaller fabric
vs standard mesh iso-performance
- Highest Bandwidth
Performance bottlenecks created by protocol bridges, fabric transit points and longer routes
Up to 3 GHz and 32 PB/s
bisection bandwidth
- Lowest Latency
Need for numerous protocol crossing bridges and scenic routes for communication flows
Lower latency
system and workload dependent
- Correct by Construction
Deadlocks, QoS and tradeoffs unclear during design development
Up to 8 virtual channels
per network, deadlock-free, QoS built-in
- Future Proof Design
Limited number of topologies, performance not scalable
8b-2048b channel width
with wide variety of topologies
- Fastest Design Closure
Performance issues slow down architecture, complexity challenges slow down implementation
Data-driven design
and physically-aware implementation
